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04/13/2020

wuhan, china, april 13, 2020 - yangtze memory technologies co., ltd (ymtc), today announced that its 128-layer 1.33tb qlc 3d nand flash memory chip, x2-6070, has passed sample verification on the ssd platform through co-working with multiple controller partners. as the first qlc based 128-layer 3d nand, x2-6070 has achieved the highest bit density, highest i/o speed and highest capacity so far among all released flash memory parts in the industry①. accompanying this release, ymtc introduced a 128-layer 512gb tlc (3 bit/cell) chip, x2-9060, to meet diversified application requirements.

02/27/2020

using cutting-edge process technology, t7520 enables an optimized 5g experience with substantially enhanced ai computing and multimedia imaging processing capabilities while lowering power consumption. 

10/16/2019

on september 2nd, 2019, right before ic china 2019 opened in shanghai, yangtze memory technologies co., ltd. (ymtc), a subsidiary owned by tsinghua unigroup, announced that it would apply xtacking® 2.0 in its third-generation 3d nand flash. tsinghua unigroup introduced the technical concept...